| PART |
Description |
Maker |
| M6MGT647M17AKT |
Memory>MCP(Multi Chip Package)>S-µMCP(Stacked micro MCP)
|
Renesas
|
| KBY00U00VA-B450 |
MCP Specification
|
Samsung semiconductor
|
| KA100O015E-BJTT |
MCP Specification
|
Samsung semiconductor
|
| S75PL127NBFJFWGZ2 S75PL127NCFJFWGZ3 S75PL256NCFJFW |
Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品（MCP
|
Spansion, Inc.
|
| DS42553 AM29DL323D |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
MCP Flash Memory and SRAM
|
AMD[Advanced Micro Devices]
|
| DS42585 AM29DL324D |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
MCP Flash Memory and SRAM
|
AMD[Advanced Micro Devices]
|
| 2-1418883-1 |
AMP MCP 1.5K / AMP MCP 2.8 REC. HOUSING, 62POS., SEALED
AMP MCP 1.5K / AMP MCP 2.8 REC. HOUSING, 62POS., SEALED
|
Tyco Electronics
|
| S71GL032A40BFI0B2 S71GL064A80BAI0B3 S71GL064A80BAI |
Stacked Multi-Chip Product (MCP) Flash Memory and RAM SPECIALTY MEMORY CIRCUIT, PBGA56
DIODE ZENER 200MW 5.1V 1005 SPECIALTY MEMORY CIRCUIT, PBGA56
DIODE ZENER 200MW 9.1V 1005 SPECIALTY MEMORY CIRCUIT, PBGA56
Stacked Multi-Chip Product (MCP) Flash Memory and RAM 堆叠式多芯片产品（MCP）的闪存和RAM
DIODE ZENER 200MW 4.7V 1005
INDUCTOR POWER 3.3UH 5.4A SMD
INDUCTOR,TOROID,HORIZONTAL, 22.0 uH,7.0 IDC,0.015 OHM,
|
Spansion, Inc.
Spansion Inc.
|
| F2223-21SH |
MCP ASSEMBLY
|
Hamamatsu Photonics
|
| KAG00J007M-FGG2 |
MCP Memory
|
Samsung Electronics
|
| WF2M16-XDAX5 WF2M16-XDLX5 WF2M16-XFLX5 |
Flash MCP 闪存MCP
|
Abracon, Corp.
Lumex, Inc.
|
| DS42515 |
MCP Flash Memory and SRAM
|
AMD
|
